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    MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead/Halogen Flux No Cleaning

    • Environmentally friendly material, lead-free and halogen-free, less smoke and less odor
    • Bright solder joints, no resistance, non-conductive
    • Less residue, less smoke, good flow performance
    • No short circuit, no need to clean, infinite conductivity
    • Scope of use: BGA/dense pin IC/mobile phone motherboard/computer motherboard/high-precision welding, etc.
    • Weight: about 20g
    • Size: about 12.7 x 2.9cm
    £6.76
    £7.85
    Availability: In stock
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    Features
    • 1. Environmentally friendly material, lead-free and halogen-free, less smoke and less odor
    • 2. Bright solder joints, no resistance, non-conductive
    • 3. Less residue, less smoke, good flow performance
    • 4. No short circuit, no need to clean, infinite conductivity
    • 5. Scope of use: BGA/dense pin IC/mobile phone motherboard/computer motherboard/high-precision welding, etc.
    • 6. Weight: about 20g
    • 7. Size: about 12.7 x 2.9cm
    Packing List
    • MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead/Halogen Flux No Cleaning
    • Original set and packaging
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